Sponsorship & Exhibition
DIAMOND
- 3 free conference seats (including conference dinner and welcome reception)
- Exhibition booth: Shell scheme 3mx3m (includes one table)
- Complimentary publicity brochure to be inserted in conference package (color)
- Company logo (linked to company website) on our conference page.
- Acknowledgement in the Banquet Dinner
- Opportunity to host an industry-related event (during lunch break, subject to room availability and limited to 30min).
GOLD
- 2 free conference seats (including conference dinner and welcome reception)
- Exhibition booth: Shell scheme 3mx2m (includes one table)
- Complimentary publicity brochure to be inserted in conference package (color)
- Company logo (linked to company website) on our conference page.
- Acknowledgement in the Banquet Dinner
- Opportunity to host an industry-related event (during lunch break, subject to room availability and limited to 30min).
Silver
- 1 free conference seat (including conference dinner and welcome reception)
- Exhibition booth: Shell scheme 2mx2m (includes one table)
- Complimentary publicity brochure to be inserted in conference package (B&W)
- Company logo (linked to company website) on our conference page.
- Acknowledgement in the Banquet Dinner
- Opportunity to host an industry-related event (during lunch break, subject to room availability and limited to 30min).
BRONZE
- Daily lunch / tea breaks for 1 representative. [No admittance to conference dinner and welcome reception]
- One complimentary table will be provided (without shell scheme)
- Complimentary publicity brochure to be inserted in conference package (B&W)
- Company logo (linked to company website) on our conference page.
- Opportunity to host an industry-related event (during lunch break, subject to room availability and limited to 30min).
PAYMENT DETAILS:
(1) Bank Transfer or Telegraphic Transfer
Name of Account: IEEE TENCON 2024
Account No: 713-206506-001
SWIFT code: OCBCSGSGXXX
Bank Code: 7339
Branch Code (only if required): 713
Branch Name: OCBC LTD
Name and address of bank:
Oversea-Chinese Banking Corporation Limited
65 Chulia Street, OCBC Centre, Singapore 049513
Note: For telegraphic transfer (TT) the sender will be responsible for all bank admin & transaction charges.
(2) Cheque Payment
All cheques are to be made in Singapore Dollars and payable to “IEEE TENCON 2024” and
mail to:
IEEE TENCON 2024 Secretariat:, c/o ace:daytons direct (international) pte ltd.
#04-01 Thye Hong Centre, 2 Leng Kee Road. Singapore 159086.
For general enquiries, please contact:
Conference Secretariat: +65 6379 5260
Email: secretariat@tencon2024.org
For Patronage Package & Exhibition enquiries, please contact: ,
| Ravinder SINGH, Infineon, Singapore Email: rpsingh@ieee.org |
Yen Kheng, TAN SIMTech, Singapore Email: tanyenkheng@yahoo.com.sg |